Ntshav etching nyias zaj duab xis cov khoom siv

Ntshav etching nyias zaj duab xis cov khoom sivyog ib txoj kev txiav-ntug kev tsim tsim rau precision stripping ntawm nyias-zaj duab xis ua, muab kev kawm tshwj xeeb hauv kev hloov kho NTO thiab cov seem tshem tawm. Kev Siv Zog Ion ovching (rie) thev naus laus zis, cov khoom siv no sib txuas nrog kev rho tawm thiab tswj zaj duab xis tshem tawm.

• Tsawg-kub ua: Lub Plasma etching nyias zaj duab xis ua haujlwm ntawm ultra-tsawg kub, txo cov kev ntxhov siab thermal thiab tiv thaiv kev tiv thaiv kev tawm tsam kev tawm tsam. Cov yeeb yam no yog qhov tseem ceeb rau cov khoom siv muag xws li cov polymers thiab precision optics.
• Kho tau etching tus nqi: Qhov kev ncua deb ntawm ion qhov chaw thiab substrate tuaj yeem hloov kho ntawm kev tswj lub zog etching (txog 30 nm / min) kom tau raws li cov kev cai sib txawv.
• Kev Lom Zem Siab: Nruab nrog patented ion cov thev naus laus zis, cov khoom tsim tawm cov ntshav siab, kom zoo nkauj thiab cov txiaj ntsig zoo ib yam li 800 hli hauv lub taub.
• Dual-ua haujlwm: Tshaj tawm kev tshem tawm kev ua yeeb yaj kiab, lub kaw lus no tuaj yeem kho tau rau ntau cov ntawv thov, suav nrog kev tu sab saum toj thiab kev kho mob rau cov txheej txheem txheej ntxiv.

TusSiv Lub Tshuab Ntxuav Ntshav NtshavKev khiav hauj lwm los ntawm kev nthuav dav ntawm lub cev ntawm lub cev thiab tshuaj lom neeg cov khoom siv tau los ntawm ionized roj (ntshav). Ntawm nws cov txheej txheem, cov kab ke tsim cov ntshav ntawm cov hluav taws xob los ntawm kev thov hluav taws xob (piv txwv li, oxygen, lossis nitrogen). Lub zog no sib cuam tshuam roj molecules rau cov hom reactive, suav nrog ions, thiab dawb radicals, sib sau lub siab-zog ntshav huab.

1, Plasma tiam:
Thaum RF zog (feem ntau 13.56 MHz lossis 40 kHz) tau thov rau cov electrodes hauv lub tshuab nqus tsev, roj molecules yauv. Qhov no tsim lub ntsej muag ci opow, ua kom lub plasma plasma plasma plasma muaj zog. Kev xaiv cov roj txheem txiav txim siab cov tshuaj tiv thaiv kev ua haujlwm: oxygen cov kab mob olidizing organic rau cov kab mob rau cov inorganic seem.

2, ntxuav tshuab:

• Lub cev pob tawb:High-zog ions hauv lub Plasma sib tsoo nrog cov khoom qias neeg saum npoo av, rhuav tshem cov lus sib txuas thiab dislodging hais los ntawm kev hloov pauv hluav taws xob. Tus txheej txheem no tshem tawm cov particulation teeb meem thiab tsis muaj zog ua cov khaubncaws sab nraud povtseg.
• Tshuaj lom neeg:Reactive Radicals (piv txwv li, OH⁎) cuam tshuam nrog cov organic paug, decomposing lawv mus rau hauv cov kuab paug los ntawm cov neeg siv hluav taws xob (COO, H₂O) uas tau muab tshem tawm ntawm lub tshuab nqus tsev.
• Cov Kev Ua Kom Zoo:Ib txhij, plasma kis lug hloov kho cov pab pawg ua haujlwm sib xyaw ua ke (-h, -cooh), txhim kho wettability thiab adhesion rau cov txheej txheem tom ntej.

Pre- thiab post-etching sib piv

• Pre-etching: Residual cov yeeb yaj kiab cov yeeb yaj kiab (piv txwv, DLC / TA-C-Ca txheej) lossis cov paug tsis tuaj yeem txwv cov adhesion thiab kev ua haujlwm kho qhov muag.
• Tom qab-etching: Ib qho pristine, cov nplaim paug tau tiav, txhim kho cov khoom muaj peev xwm txuas ntxiv hauv cov khoom lag luam xws li cov khoom siv hluav taws xob zoo li cov khoom siv hluav taws xob zoo li cov khoom siv hluav taws xob zoo li cov khoom siv hluav taws xob zoo li cov khoom siv hluav taws xob zoo li lub zog.

• Etching roj: AR, O₂
• Kev pab fais fab: 380v / 50Hz, 10 kw
• Lub tshuab nqus tsev: Molecular twj tso kua mis nrog paus siab tsawg dua los yog sib npaug rau 5. 0 × 10 nc
• Tib neeg: Chamber loj thiab sab nraud qhov ntev tuaj yeem ua kom haum rau cov neeg xav tau kev pab.

• Nyias-zaj duab xis tshem tawm rau cov iav lo ntsiab muag, muab cov vaj huam sib luag, thiab cov cuab yeej precision.
• Kev kho mob ua ntej hauv 3C Electronics, cov cuab yeej kho mob, thiab kev lag luam hluav taws xob tshiab.