PVD Multi- Txheej Txheem Nyias Zaj Duab Xis yog ib qho kev sib xyaw ua ke ntawm lub tshuab nqus tsev vacuum uas tsim los ua ke ntau yam txheej txheem nyias- zaj duab xis fabrication-xws li RF/DC Magnetron Sputtering, Thermal Evaporation, thiab Electron Beam Evaporation- nyob rau hauv ib lub tshuab nqus tsev vacuum.

Cov txheej txheem no tshem tawm lub tshuab nqus tsev vacuum sib kis ntawm cov txheej txheem sib txawv, ua kom cov txheej txheem ntau- txheej hlau, dielectric, thiab semiconductor films yam tsis muaj qhov cuam tshuam los ntawm ib puag ncig. Configured rau lub chaw soj nstuam R&D pawg los yog tsav- kab ntau lawm, nws haum substrates mus txog 300mm inch los yog customized carriers.

Technical Specifications

Parameter	Specification Paub meej
Ultimate Base Siab	< 5.0 x 10^-6 Pa (Achieved via Turbo-Molecular and Cryogenic Pumping)
Chamber Khoom	304L / 316L Stainless hlau, Electro{2}}Polished (Ra <0.25 um)
Substrate Compatibility	Silicon Wafers (txog 300mm), iav, Quartz, Hlau Foils, Flexible Substrates
Deposition Sources	Mus txog 4 Sputter Cathodes (2-inch txog 4-nti), 2 E-Beam Pockets, 2 Thermal Boats
Film Uniformity	+/- 1% hla thaj tsam 200mm substrate (rotation-pab)
Substrate cua sov	Ambient mus rau 800 C nrog PID kaw -loop kub tswj
Cov khoom siv hluav taws xob	DC (txog 5kW), RF (13.56MHz, mus txog 2kW), Pulsed DC rau reactive sputtering
Tswj System	PLC + Muaj PC, SCADA software, daim ntawv qhia tag nrho automation thiab phau ntawv hla dhau

Ntsiab nta

Modular Vacuum Architecture:Cov txheej txheem ywj pheej txuas nrog ntawm lub rooj vag li qub tiv thaiv kev hla -kev sib kis ntawm reactive sputtering thiab siab - nqus evaporation.

Hauv -Nqus Substrate Transfer:Sib nqus lossis linear hloov caj npab tuav lub tshuab nqus tsev siab (< 10^-4 Pa) during inter-chamber sample movement.

Ceev-Hloov qhov chaw Flanges:Sputter cathodes thiab e-beam crucibles yog mounted rau tus qauv CF flanges rau kev kho ceev ceev thiab lub hom phiaj hloov.

Advanced Cryogenic Traping:Kev sib xyaw ua kua nitrogen txias ntxiab thiab Meissner ntxiab txo qis cov dej vapor siab nyob rau hauv lub chamber.

Kaw -Loop Thickness Saib Xyuas:Dual quartz siv lead ua microbalance (QCM) sensors muab qhov tseeb -lub sij hawm tso nyiaj thiab cov lus qhia tuab txuas ncaj qha rau kev tswj fais fab.

Nqus System Configuration

Roughing Theem:Roj-cov twj tso kua mis pub dawb ua ke nrog ntau- theem cov hauv paus hniav kom tshem tawm cov hydrocarbon rov qab- streaming.

High Vacuum Stage:Backed by magnetically levitated turbo-molecular pumps (>1200 L / s rau N2) thiab yeem cryopumps rau cov dej siab - vapor throughput.

Txoj Cai Siab:Baratron capacitance manometers rau kev ntsuas siab tsis txaus ntseeg ntawm cov roj hom, ua ke nrog lub tshuab nqus tsev twj tso kua mis rau cov txheej txheem siab tswj roj (0.1 Pa rau 10 Pa).

Leak Detection:Helium leak-kuaj rau <1 x 10^-9 Pa*m^3/s ua ntej lub Hoobkas lees txais (FAT).

Evaporation Materials & Substrate Compatibility

Lub Hom Phiaj Coj:Au, Ag, Cu, Al, Ti, Cr, ITO, AZO, Mo, W, NiCr.

Cov khoom siv Dielectric:SiO2, TiO2, Al2O3, Ta2O5, HfO2 (ntawm reactive sputtering los yog e-beam).

Hom substrate:
Semiconductor wafers (Silicon, Gallium Arsenide, Indium Phosphide).

Optical blanks (Fused silica, BK7, Sapphire).

Yooj yim webs thiab nyias hlau los xij (Polyimide, stainless hlau ntawv ci).

Daim ntawv thov & Cov ntaub ntawv pov thawj kev ua tau zoo

Optoelectronics:Kev tso tawm ntawm pob tshab conductive oxide (TCO) cov khaubncaws sab nraud povtseg thiab tiv thaiv -reflective (AR) optical filter stacks.

Semiconductor Device Fabrication:Tsim cov ohmic contacts, Schottky barriers, noob txheej rau electroplating, thiab diffusion barriers (Ti/TiN).

Sensor Manufacturing:Nyias-film metallic strain gauges, micro-heater element, thiab piezoelectric transducers.

Advanced R & D:Tshawb nrhiav ntau- txheej nyias- zaj duab xis synthesis rau quantum suav cov khoom thiab cov khoom siv hluav taws xob tshiab.

Customization Options

Chamber Geometry:Expanding chamber dimensions rau cov uas tsis yog -tus qauv los yog oversized batch substrates.

Kev koom ua ke Source:Kev faib faib sib piv ntawm cov phom magnetron sputtering thiab electron beam evaporation hnab ris.

Bias Sputtering:Substrate RF / DC biasing xaiv rau zaj duab xis densification thiab tswj kev ntxhov siab.

Load-Xov kev koom ua ke:Ntxiv ntawm cov khoom siv hluav taws xob tsis siv neeg-lock chambers kom tswj tau lub tshuab nqus tsev siab thaum lub sij hawm siab -throughput loading cycles.

Kev Tswj Xyuas Zoo & Kev Xeem Lub Hoobkas

Khoom siv Traceability:Daim ntawv pov thawj zeb xeem (MTCs) muab rau txhua lub tshuab nqus tsev -sab stainless hlau Cheebtsam thiab cov qauv thav duab.

Cleanroom Assembly:Kev sib koom ua ke zaum kawg thiab particle- suav txheeb xyuas tau ua nyob rau hauv ISO Class 6 ib puag ncig huv.

Factory Txais Kev Xeem (FAT):72-teev lub tshuab nqus tsev vacuum tas mus li, kev ntsuam xyuas los ntawm cov roj seem seem (RGA) huab hwm coj spectrometry, thiab lub hauv paus zaj duab xis deposition khiav xyuas cov thickness uniformity.

Installation & Technical Support

Phau Ntawv Qhia Kev Npaj Qhov Chaw:Comprehensive utility mapping provided pre-shipment, detailing chilled water flow rates (>15 L / min), compressed cua, txheej txheem roj (Ar, O2, N2 ntawm 99.999% purity), thiab hluav taws xob load (3-theem 380V / 480V).

Kev Ua Haujlwm:Ntawm - qhov chaw teeb tsa, lub tshuab nqus tsev calibration, thiab kev sim sib koom ua ke- khiav los ntawm cov kws ua haujlwm hauv chaw ua haujlwm hauv chaw ua haujlwm.

Kev cob qhia neeg ua haujlwm:Cov txheej txheem 5-hnub kev cob qhia nyob rau ntawm qhov chaw uas suav nrog kev saib xyuas niaj hnub, cov txheej txheem kev nyab xeeb ntawm lub tshuab nqus tsev, kev npaj daim ntawv qhia, thiab kev daws teeb meem yooj yim.

Cov lus nug nquag

Q: Dab tsi yog lub twj tso kua mis ib txwm- lub sij hawm poob ntawm huab cua mus rau qhov kawg ntawm lub hauv paus siab?

A: Siv cov qauv roj-dawb roughing thiab turbo-molecular twj tso kua mis configuration, lub system ua tiav lub hauv paus siab ntawm <5.0 x 10^-6 Pa nyob rau hauv 45 feeb los ntawm qhuav, huv si pib.

Q: Lub kaw lus puas tuaj yeem hloov kho hauv thaj teb los ntawm ib lub chamber mus rau ntau-chamber pawg?

A: Yog. Tus qauv tsim qauv suav nrog cov qauv ConFlat (CF) flanged ports thiab cov qauv kev sib txuas ntawm cov khoom siv sib txuas, tso cai rau kev sib koom ua ke ntawm cov khoom tso tawm ntxiv lossis thauj khoom - xauv modules ntawm koj qhov chaw.

Q: Dab tsi kev nyab xeeb interlocks tau koom ua ke rau hauv kev tswj hwm?

A: PLC architecture suav nrog cov khoom siv kho vajtse- theem kev cuam tshuam rau cov dej txias tsis ua haujlwm, compressed cua siab poob, rov qab lub twj tso kua mis, dhau - qhov kub thiab txias, thiab lub tshuab nqus tsev vacuum tiv thaiv qhov tsis zoo.

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