Product Overview

 

Lub IAE-Series Ion-Assisted Evaporation Thin Film Equipment integrates lub cev vapor deposition (PVD) nrog tiag tiag - lub sij hawm ion beam bombardment. Los ntawm kev coj cov ions nquag mus rau lub substrate thaum lub sij hawm thermal los yog electron -beam evaporation, lub kaw lus hloov lub zog mus rau condensing adatoms, restructuring lub loj hlob zaj duab xis lub microstructure.


Qhov no kinetic zog hloov mus tshem tawm cov columnar voids, suppresses noo noo nqus, thiab xauv lub refractive index tiv thaiv ambient humidity hloov. Ua rau kev ua haujlwm tas mus li ntau- hloov pauv hauv cov kab hluav taws xob thiab cov khoom siv hluav taws xob, lub platform tuav cov substrates xws li siab - laser optics rau silicon wafers.

 
 
Technical Specifications

 

Parameter

Specification

Qhov kawg Base Siab

< 5.0 × 10⁻⁵ Pa (achieved within 45 mins via cryogenic/turbomolecular pumping)

Evaporation Sources

Multi-pocket E-beam phom (4 × 15cc txog 40cc) thiab cov khoom siv hluav taws xob tiv taus

Ion Source Hom

Gridless End-Hall / Kaufman- hom ion qhov chaw (beam voltage: 50 - 1500 V, ion tam sim no: 0.1 - 3 A)

Zaj duab xis Thickness Tswj

Quartz siv lead ua microbalance (QCM) + Optical monitoring system (OMS), precision ± 0.1 nm

Substrate Fixturing

Planetary rotation fixture, dome radius customized rau substrate geometry

Substrate cua sov

Radiant rhaub array, mus txog 350℃nrog ± 2℃PID uniformity

Tswj Architecture

PLC + Industrial PC, automated daim ntawv qhia ua tiav, SECS / GEM cov ntaub ntawv ua raws

 

Ion{0}}Txoj Kev Pab Cuam Tshuam

 

Vapor Generation:

Cov khoom yog evaporated los ntawm e-beam crucible lossis thermal nkoj ntawm kev tswj kev tso nyiaj (0.1 - 2.0 nm / s).

01

Momentum Hloov:

Lub zog ions (Ar⁺, O⁺) foob pob hluav taws ntawm substrate nto ib txhij nrog cov vapor flux los ntawm E- nqaj lossis qhov chaw thermal.

02

Kev hloov kho microstructure:

Ion cuam tshuam txhim kho adatom nto txav mus los, tiv thaiv kev loj hlob ntawm columnar grain thiab ua tiav nyob ze -bulk ntom (packing ntom> 99%).

03

Stoichiometry Kho:

Reactive ion pab (O₂) ua kom tiav oxidation ntawm sub{0}}oxides hauv cov hlau oxide zaj duab xis (piv txwv li, Ta₂O₅, Nb₂O₅, SiO₂), tshem tawm cov plua plav nqus hauv UV-NIR spectrum.

04

 

Cov ntaub ntawv zaj duab xis
 
 

Oxides:

SiO₂, Ta₂O₅, TiO₂, Nb₂O₅, HfO₂ (High refractive index stability rau optical filters).

 
 
 

Fluorides:

MgF₂, LaF₃ (Low refractive index layers for broadband AR coatings).

 
 
 

Hlau:

Al, Ag, Au, Ti (Adhesion layers and metallic reflectors).

 

 

Daim ntawv thov

Laser & Precision Optics:

Bandpass lim, dichroic tsom iav, thiab laser tiv thaiv coatings yuav tsum tau laser siab -induced puas threshold (LIDT) thiab xoom spectral hloov nyob rau hauv thermal stress.

LiDAR Cover iav:

Lub zog tiv thaiv-reflective (AR) thiab los tiv thaiv- cov yeeb yaj kiab nyias resistant rau huab cua hnyav sab nraum zoov.

productcate-550-450
productcate-550-450

Semiconductor Ntim:

Cov dej noo- thaiv thaiv cov txheej txheej thiab cov ntaub qhwv hlau uas tso rau ntawm qhov kub thiab txias.

Biomedical Sensors:

Biocompatible optical cuam tshuam txheej rau kev kuaj mob microfluidic chips.

 

 
 
Kev kho kom haum

Chambers thiab internal layouts yog engineered rau kev tsim hneev taw thiab cov txheej txheem yuav tsum tau ua:

01.

Chamber Dimensions:

Scalable los ntawm R=600 mm R&D units rau R=1200 mm siab - muaj peev xwm ntau lawm systems.

02.

Pumping Packages:

Configurable nrog Maglev turbomolecular twj tso kua mis, cryopumps, thiab hauv paus blower backing kab raws li gas load yuav tsum.

03.

Kev koom ua ke Source:

Dual-Ion qhov chaw teeb tsa lossis co- teeb tsa kev teeb tsa rau cov hlau tsis sib xws thiab ntau- txheej gradient films.

04.

Qib Automation:

Kev koom ua ke nrog automated cleanroom substrate transfer systems (EFEM / Vacuum cluster tools).

 

Kev Tswj Xyuas Zoo
 

Leak Detection:

Txhua lub tshuab nqus tsev vacuum yog helium leak-kuaj siv lub tshuab ntsuas huab cua (kawg tus nqi <1.0 × 10⁻¹⁰ Pa·m³/s).

Cheebtsam Traceability:

Lub tshuab nqus tsev vacuum, cov tswj huab hwm coj ntau (MFCs), thiab cov khoom siv hluav taws xob tau los ntawm cov khoom tsim nyog Tier-1 muaj npe (MKS, Inficon, VAT).

Factory Txais Kev Xeem (FAT):

Khiav- kuaj xyuas lub hauv paus siab, twj tso kua mis nkhaus, qhov chaw ruaj khov, thiab 24- teev tas mus li qhov khoob-chamber endurance ua ntej xa khoom.

Metrology Validation:

Cov qauv sau ua pov thawj ntawm spectrophotometer (transmittance/reflectance) thiab atomic force microscopy (surface roughness Ra <0.5 nm).

 

Installation & Technical Support
 
 
 

Phau Ntawv Qhia Kev Npaj Qhov Chaw:

Cov kev xav tau kev siv hluav taws xob tau muab ua ntej xa khoom (dej dej txias / siab, chav huv compressed cua, hluav taws xob faib, tso pa tawm).

 
 

Turnkey Commissioning:

Field service engineers lis mechanical assembly, nqus tsev vacuum -out, ion beam calibration, and initial process recipe sign-off on -site.

 
 

Kev cob qhia neeg ua haujlwm:

Kev tsim qauv tes- ntawm kev cob qhia npog cov kev tu niaj hnub, kev nyab xeeb ntawm lub tshuab nqus tsev, kev ua haujlwm software, thiab kev daws teeb meem.

 
 

Kev them nyiaj yug Lifecycle:

Tej thaj chaw deb diagnostic interface rau ceev software teeb meem; Cov khoom lag luam hauv cheeb tsam ntawm cov khoom siv tseem ceeb (filaments, crucibles, shields) xa tuaj hauv 48 teev.

 

 

 

FAQ

 

 

Q: Yuav ua li cas ion kev pab tiv thaiv spectral hloov nyob rau hauv optical lim?

A: Cov pa thermal evaporation tawm hauv cov duab me me hauv cov yeeb yaj kiab, uas nqus cov dej noo nyob ib puag ncig, hloov lub cev tuab thiab qhov ntsuas tsis pom. Ion bombardment ua rau kom cov zaj duab xis ntim ntom ntom saum toj 99%, sealing lub microstructure tiv thaiv ya raws nkag mus thiab xauv qhov muag tsis pom kev ruaj khov nyob rau hauv qhov chaw sib txawv ntawm cov av noo.

Q: Dab tsi yog qhov kev saib xyuas ib ntus rau daim phiaj ion?

A: Nyob ntawm cov txheej txheem gases (Ar vs. reactive O₂) thiab kev khiav hauj lwm lub zog, daim phiaj yuav tsum tau ua txhua txhua 150 mus rau 300 teev. Gridless End-Hall designs txuas ntxiv cov qhov rais ua haujlwm tau zoo los ntawm kev tshem tawm cov kab sib txuas ntawm lub cev uas raug cuam tshuam rau kev hnav.

Q: Cov cuab yeej no puas tuaj yeem koom ua ke nrog lub Hoobkas automation uas twb muaj lawm?

A: Yog. Cov tswj software txhawb SECS/GEM thiab OPC UA raws tu qauv, tso cai ncaj qha mus rau Manufacturing Execution Systems (MES) rau kev tswj daim ntawv qhia thiab ntau taug qab.

Peb tau zoo-paub tias yog ib qho ntawm cov ua ion-pab evaporation nyias zaj duab xis cov khoom lag luam thiab cov muag khoom hauv Suav teb. Yog hais tias koj yuav mus yuav customized ion - pab evaporation nyias zaj duab xis khoom ua nyob rau hauv Tuam Tshoj, txais tos kom tau pricelist los ntawm peb lub hoobkas. Rau nqe kev sab laj, tiv tauj peb.

Xa kev nug
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