PVD Composite Thin Film System

PVD Composite Thin Film System

Paub meej
Kev lag luam- qib nqus txheej txheej ua ke nrog magnetron sputtering (RF/DC/HiPIMS) thiab cathodic arc evaporation. Tsim los ua ntu zus, ntau- txheej, hlau, thiab nano- sib xyaw nyias- zaj duab xis tso tawm ntawm qhov ntsuas ntau lawm.
Kev faib tawm yam khoom
PVD Composite Thin Film Equipment
 
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Hauj lwm lawm
Kev tsis

Kev lag luam- qib nqus txheej txheej ua ke nrog magnetron sputtering (RF/DC/HiPIMS) thiab cathodic arc evaporation. Tsim los ua ntu zus, ntau- txheej, hlau, thiab nano- sib xyaw nyias- zaj duab xis tso tawm ntawm qhov ntsuas ntau lawm.

 

Technical Specifications

 

Parameter

Specification nqi

Qhov kawg nqus siab

<= 5.0 x 10^-4 Pa (Turbo-molecular and roots-rotary pump configuration)

Chamber Dimensions

Customized sizing los ntawm D 600 mm x 600 mm rau D 1500 mm x 1500 mm (304/316L electro- polished stainless hlau)

Deposition Sources

Configurable: 2-6 magnetron sputtering cathodes / 2-4 qhov chaw arc

Substrate Bias Power

0 mus rau -1000 VDC adjustable (pulsed DC rau dielectric substrates)

Zaj duab xis Thickness Uniformity

<= +/- 3% across standard planar holder (via dynamic planetary rotation)

Substrate kub

Ambient rau 650℃(+/- 2℃PID kaw-loop tswj)

Fais fab faib

RF (13.56 MHz), DC, Pulsed DC, thiab Mid -Frequency (MF) nrog arc suppression

 

Ntsiab nta


Dual{0}}Technology kev koom ua ke:Ua ke sputtering (nqus, amorphous compound films) thiab cathodic arc (siab-ionization hlau / alloy deposition) nyob rau hauv ib lub twj tso kua mis-down voj voog.


Kaw-Loop Gas Management:Mass Flow Controllers (MFCs) ua ke nrog kho qhov muag emission saib xyuas (OEM) stabilize reactive gas ib nrab siab.


Mechanical Isolation:Multi-axis planetary drives cais cov neeg kho tshuab bearings los ntawm cov txheej txheem cheeb tsam, tiv thaiv cov khoom paug.


Thermal Architecture:Muab ob npaug rau- phab ntsa dej- cov phab ntsa txias chamber thiab tiv thaiv hluav taws xob tiv thaiv thermal distortion thaum lub sijhawm siab - lub zog ua haujlwm.


Automation Core:Siemens S7-1500 PLC thiab WinCC SCADA architecture rau kev cuam tshuam ntawm lub sijhawm, roj, thiab kev saib xyuas lub zog.

 

Nqus System Configuration


Roughing Tsheb ciav hlau:Direct-tsav cov twj tso kua mis tig rov qab los ntawm cov hauv paus hniav tshuab nrog cov kua nplaum sib nqus.


Lub tshuab nqus tsev siab:Magnetically levitated turbo- cov twj molecular (1200 - 3200 L/s) lossis cryogenic twj.


Kev kuaj mob:Integrated Helium mass spectrometer test ports thiab automated sequencing interlocks.

 

Khoom siv & Substrate Compatibility


Cov ntaub ntawv hom phiaj:
Hlau:Ti, Cr, Al, Zr, Cu, TiAl, CrAl, Si


Ceramics / Compounds:TiN, CrN, TiAlN, DLC, Al2O3, SiO2


Substrates:Cov cuab yeej hlau (H13, M2, carbide inserts), Titanium / Aluminium structural alloys, engineering ceramics, thiab silicon wafers.

 

Kev siv & pov thawj kev ua tau zoo


Cov cuab yeej txiav:Tsawg-kev sib txhuam, siab-hardness ntau- txheej txheej (TiAlN/TiN) rau kev siv lub neej ntev nyob rau hauv qhuav siab- ceev machining.


Automotive:Hnav thiab tiv thaiv -scuffing coatings rau piston rings thiab roj txhaj koob pins.


Aerospace:Oxidation-tiv thaiv thermal barrier thiab tiv thaiv zaj duab xis ntawm compressor hniav thiab fasteners.


Optics & Electronics:Conductive pob tshab oxides (ITO) thiab cov ntxaij lim dej kho qhov muag.

 

Customization Options


Chamber Geometry:Rectangular box configurations rau batch khib loading los yog cylindrical inline geometries.


Tau qhov twg los Retrofitting:Interchangeable cathode mounting flanges rau teb hloov mus rau CFUBMS.


Plasma Etching:Kaufmann- hom phom ion lossis hollow cathode qhov chaw rau hauv -situ substrate tu.

 

Kev Tswj Xyuas Zoo & Kev Xeem Lub Hoobkas


Vacuum Integrity:Helium leak test pib<= 1 x 10^-9 Pa*m^3/s.


Nto tiav:Chamber internal welds electro- polished rau Ra<= 0.4 um.


FAT:72- teev nruam qhuav-khiav ntawm lub tshuab nqus tsev, kev txav chaw, thiab kev ruaj ntseg interlock loops ua ntej crating.


Kev Ua Raws Cai:Ua rau CE cov lus qhia kev siv tshuab thiab ISO 9001 tus qauv. (Trust Badge Icons: ISO 9001, CE, UL)

 

Installation & Technical Support


Documentation Bundle:P&ID schematics, hluav taws xob thaiv daim duab, PLC qhov chaw logic, thiab CE / UL cov ntaub ntawv ua raws.


Kev Ua Haujlwm:Field engineers saib xyuas txhua qhov chaw, kev siv hluav taws xob sib txuas, thiab kev txheeb xyuas cov dej xau.


SAT & Daim Ntawv Qhia Kev Qhia:Hauv - qhov kev sim ntsuas qhov chaw pib thiab kev ua kom zoo ntawm daim ntawv qhia.

 

FAQ

 

Q: Dab tsi yog lub twj tso kua mis - lub sij hawm qis rau lub hauv paus siab?

A: ncav <5.0 x 10^-4 Pa li ntawm 45 feeb nyob rau hauv huv si, qhuav, thiab ambient thermal tej yam kev mob.

Q: Lub kaw lus puas tuaj yeem hloov pauv ntawm DC thiab RF sputtering nruab nrab - txheej txheem?

A: Yog. Lub hwj chim matrix tso cai rau software- tswj kev sib txuas ntawm DC, pulsed DC, thiab RF yam tsis muaj lub tshuab nqus tsev tawg.

Q: Cov khoom siv hluav taws xob dab tsi yuav tsum muaj ntawm -site?

A: Chilled dej (15 mus rau 20℃ntawm 0.3 mus rau 0.4 MPa), compressed cua (0.6 MPa), siab - purity txheej txheem gases (Ar, N2, O2 ntawm 99.999%), thiab mob siab rau 3-theem industrial zog.

Q: Yuav ua li cas substrate kub tswj thaum lub sij hawm deposition?

A: Integrated infrared pyrometers ua ke nrog radiant heater banks thiab PID kaw -loop tswj.

 

Cim npe nrov: Tuam Tshoj pvd nyias zaj duab xis system manufacturers, lwm tus neeg, Hoobkas

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